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Adhesives Technology for Electronic Applications: Materials, by James J. Licari,Dale W. Swanson PDF

By James J. Licari,Dale W. Swanson

ISBN-10: 0128103701

ISBN-13: 9780128103708

ISBN-10: 1437778895

ISBN-13: 9781437778892

Adhesives are familiar within the manufacture and meeting of digital circuits and items. mostly, electronics layout engineers and production engineers are usually not good versed in adhesives, whereas adhesion chemists have a constrained wisdom of electronics. This booklet bridges those wisdom gaps and comes in handy to either teams.

The ebook comprises chapters overlaying varieties of adhesive, the chemistry on which they're established, and their homes, functions, techniques, standards, and reliability. insurance of toxicity, environmental affects and the regulatory framework make this publication quite vital for engineers and executives alike.

The 3rd variation has been up to date all through and comprises new sections on nanomaterials, environmental affects and new environmentally pleasant ‘green’ adhesives. information regarding rules and compliance has been introduced absolutely up-to-date.

As good as delivering complete assurance of normal adhesive varieties, Licari explores the newest advancements in fields such as:

• Tamper-proof adhesives for digital defense devices.

• Bio-compatible adhesives for implantable clinical devices.

• Electrically conductive adhesives to switch poisonous tin-lead solders in revealed circuit meeting – as required by way of regulatory regimes, e.g. the EU’s restrict of dangerous components Directive or RoHS (compliance is needed for all items put on the eu market).

• Nano-fillers in adhesives, used to extend the thermal conductivity of present adhesives for cooling digital devices.

  • A whole advisor for the electronics to adhesive kinds, their homes and purposes – this ebook is a vital reference for a variety of experts together with electric engineers, adhesion chemists and different engineering professionals
  • Provides necessities of adhesives for specific makes use of and descriptions the strategies for program and curing – insurance that's of specific gain to layout engineers, who're charged with growing the interface among the adhesive fabric and the microelectronic device
  • Discusses the respective merits and boundaries of alternative adhesives for a various functions, thereby addressing reliability matters ahead of they take place and delivering invaluable info to either layout engineers and caliber coverage personnel

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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